GE Intelligent Platforms’ rugged COM Express modules offer ultimate durability and varying levels of performance-per-watt. They are well-suited for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Onboard components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, our processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.
Read why Hexagon Geospatial Solutions, a leading global provider of integrated design, measurement, and visualization technologies, selected GE’s rugged bCOM6-L1400 COM Express module for its enhanced video processing and high-end graphic functions.