RCOM05

The RSYS05 chassis is designed to meet the needs of military and especially space applications where extreme stiffness, low weight together with conduction cooling are required. The housing is manufactured from Aluminium using the dip brazing technology - guaranteeing by this maximum ruggedness at minimum weight. The chassis can be equipped with a 4 slot bus, VMEbus or CPCI or any customer specific bus system. Additionally one slot is foreseen for the Power Supply (5 slot overall). All I/O wiring harness is routed through the backplane to the dedicated I/O connectors. A Power Supply with dual/redundant power input may be optionally used for providing the supply voltages (5V, +/-12V) of the boards. For excellent EMI protection MIL-C-38999 series II connectors were chosen. Other connector types or higher connector quantity are also possible on request. Power dissipation of boards is drained away by conduction cooling through chassis walls. Maximum roughness of Base Plate is below 1.6 micron ensuring by this a perfect contact to the cooling plate. Boards are to be fixed with wedge locks per IEEE-1101.2. The space grade version is available with conduction cooled MIL-883 or even ESA-SCC parts, stiffener bars, wedge locks (PSU), and conformal coating - all materials are compliant to manned space flight requirements. Commercial versions with and without coating are also available. Systems are built and tested to custom requirements.